SEOUL (Reuters) -South Korea’s SK Hynix said on Friday it has completed its internal certification process for next generation high-bandwidth memory 4(HBM4) chips and established a production system for customers.

In March, the South Korean chipmaker, a key supplier to AI giant Nvidia, said it had shipped its HBM4 12-layer chip samples to customers, adding that the company aims to complete preparations for mass production of 12-layer HBM4 products within the second half of this year.

HBM – a type of dynamic random access memory or DRAM standard first produced in 2013 – involves stacking chips vertically to save space and reduce power consumption, helping to process the large volumes of data generated by complex AI applications.

SK Hynix shares hit a record high in morning trade, rising

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