It is pretty much confirmed that TSMC will begin 2nm wafer production by the end of 2025 , but the world’s biggest semiconductor manufacturer aims to maintain its dominant lead by pursuing a manufacturing process even lower than the aforementioned lithography; 1.4nm, which is also known as A14. According to the latest report, the company will commence the very first steps of 1.4nm wafer production on its local turf, but will seemingly not rely on ASML’s cutting-edge and ludicrously expensive High-NA EUV machinery.

Instead of using High-NA EUV equipment of the 1.4nm process, TSMC will resort to complex multi-patterning techniques to achieve its goals

Even though Commercial Times reports that TSMC will break ground on its 1.4nm fabrication plant in Taichung by the end of this year, mass

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