The newer 2nm process can continue to utilize the current EUV machines that TSMC has in place for mass producing wafers with a higher yield percentage, but as the Taiwanese semiconductor behemoth moves to sub-2nm nodes like 1.4nm and 1nm, also known as A14 and A10, respectively, it will run into manufacturing roadblocks. Now, this problem can easily be scaled with the purchase of ASML’s cutting-edge High-NA EUV machinery, but a new report states that instead of making the purchase, TSMC will move to photomask pellicles.

Photomask pellicles are expected to be less costly than purchasing a $400-million-dollar High-NA EUV machine, though TSMC will be moving to a ‘trial and error’ approach to improve production reliability

Full-scale production of 2nm wafers is expected to start by the end

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