New Delhi, Dec 12 (IANS) Under the Semicon India Programme, 10 units have been approved with an investment of Rs 1.6 lakh crore, which include silicon fab, silicon carbide fab, advanced packaging, and memory packaging, the Parliament was informed on Friday.

Union Minister of State for Electronics and IT, Jitin Prasada, said that these would cater to chip requirements of sectors such as consumer appliances, industrial electronics, automobiles, telecommunications, aerospace, and power electronics etc.

“Few of the approved proposals are using indigenous technology for assembly, testing, and packaging of semiconductor chips,” he said in the Rajya Sabha.

The government launched a production-linked incentive scheme (PLI) for large-scale electronics manufacturing of mobile phones and certain s

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