TSMC is Reportedly Overwhelmed by Advanced Packaging Demand, Forced to Fast

TSMC is reportedly facing massive demand for its advanced packaging services, mainly due to its dominant usage in AI chips from NVIDIA and others.

TSMC Is Forced To Schedule Production By Up To One Year Earlier, Creating Huge Pressure On The Supply Chain

TSMC is undoubtedly one of the leading suppliers for advanced packaging technologies like CoWoS, alongside other suppliers such as ASE Technology. However, the Taiwan giant is known to make up for a massive portion of packaging production, but now, the demand is so immense that TSMC cannot keep up with customers' demand alone. Based on comments by TSMC's Vice GM of Advanced Packaging Technology ( via TED ), it is revealed that the firm has to speed up its packaging product roadmap to keep up with the AI roadmaps from NVIDIA and others.