Electronics don’t play nicely with most liquids, which is why liquid cooling in the datacenter is often considered a little dangerous. Microsoft, however, has found a way to dispel such worries with a scheme that sees liquids flow across the surface of chips.

As explained in a Tuesday post , the technique is called “Microfluidics” and sees “Tiny channels … etched directly on the back of the silicon chip, creating grooves that allow cooling liquid to flow directly onto the chip and more efficiently remove heat.”

Microsoft says each groove is “similar in size to human hair”, and that it placed them after analysis – helped by AI, because 2025 – to determine which parts of a chip need cooling. The result is a matrix of grooves that the software giant says “resembles the veins in a leaf or a

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